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LGA

 

 

Applications

 RF,Wireless, GPS, Switch Devices 

 Logic,Analog, and MEMS Sensors

 SiP Solutions

 Industry Micro-Controller

Features:

 Customized package size and leads in limited body size (1~ mm )

 Au, Cu, Ag-alloy bonding process capabilities

 Multi-chip capability for stack or flat lie

 Component surface mount capability

 Ni/Au,Ni/Pd-Au surface finish

Reliability Condition:

 Moisture Sensitivity Pre-condition :
   -MSL3: 192hrs@30℃/60% RH
   -MSL1: 168hrs@85℃/85% RH

 Temperature Cycle: 500 cycles @ -65℃ /+150℃

 Highly Accelerated Temp and Humidity Stress Test: 96hrs @130oC/85% RH

 High Temperature Storage: 1000hrs@150℃

Package Outlines   Dimensions:

Substrate
Formats
(mm)

Standard

Sub. Thickness

(mm)

Standard

Sub. Layer

Mold Cap

Thickness

(mm)

Pkg Thickness

(mm)

189*68
2 Block
Min: 0.150
Max: 0.360
2/4/6 0.375
0.550
0.750
>0.500



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